Ultra-fast elemental profile
Typical erosion rates in the order of micrometers per minute allow monitoring processes, lots and multiple points of the sample.
HORIBA · Pulsed-RF GD-OES
GD-Profiler 2: elemental composition in depth
Rapid elemental characterization of layered materials, with simultaneous optical emission, pulsed RF source and direct measurement of depth by differential interferometry.
HORIBA
Analytical differences
Fast acquisition across the full layer structure
The system combines fast sputtering, simultaneous optical detection and features dedicated to signal conversion into concentration and depth.
Surface resolution to the substrate
Profiles with nanometric or subnanometric resolution in appropriate applications, extending to layers with more than 150 μm.
All elements simultaneously
High dynamic optical detection to simultaneously monitor elements of interest throughout the profile.
Conductive and non-conductive materials
The pulsed RF source expands the analysis for insulators, hybrid materials, polymers and heat sensitive samples.
Depth measured during analysis
DiP measures the depth and erosion rate in real time, simultaneously with the GD profile.
From hydrogen to infrared
Optical coverage of VUV to IR for light element lines and relevant species in technological materials.
120–800 nmSpectral coverage
2–10 nm/sTypical indicated erosion
>150 µmDepth in appropriate applications
From solid to result
A layer-by-layer depth profile
The source spatially separates erosion and emission, favoring a direct relationship between optical intensity and plasma concentration.
01
Place sample
The surface is placed against the O-ring and before the source anode tube.
02
Establish the RF plasma
Low pressure argon plasma initiates controlled spraying.
03
Measure emission
The system simultaneously follows the lines of the elements over time.
04
Convert time into depth
Quantum processes concentration, thickness and interfaces; DiP can measure depth directly.
Applications
Materials in which distribution matters as much as composition
GD-Profiler 2 is especially useful when the question involves surface, coating, interface, gradient or substrate.
Batteries
Positive and negative electrodes, thick layers and superficial interfaces, including strategies for air-sensitive samples.
Nitriding and diffusion
Profiles in depth of nitrogen, carbon and other elements in steel and alloy treatments.
LED and semiconductors
Control of processes, interfaces and multilayer structures with high resolution in depth.
Metal coatings
Thickness, uniformity, composition, defects and interactions between coating and substrate.
Hydrogen and deuterium
Direct measurement of H and possibility to track H and D simultaneously in specific applications.
Photovoltaics
Functional films, solar cells, contacts, transparent layers and process development.
Polymers and hybrids
Rapid profiles in polymer layers, insulating and organic-inorganic combinations.
Advanced materials
Multilayers, gradients, oxides, functional surfaces and diffusion studies and failures.
Architecture and performance
Pulsed source, high-dynamic-range optics and DiP
The architecture was designed to maintain speed, depth resolution and flexibility of materials on the same platform.
See full catalogueDischarge sourcePlasma RF 13,56 MHz, low pressure and pulsed operation.
Spectral coverage120–800 nm, from VUV to infrared.
Optical detectionSimultaneous measurement with High Dynamic Detection and high resolution monochrome option.
Depth profileFrom the first nanometer to more than 150 μm, according to material and method.
DiPDifferential interferometry for simultaneous measurement of depth and erosion rates.
MaterialsConductors, non-conductors, polymers, hybrids, thin films and thick layers.
throughputWide compartment and optional Sample Mapping Unit for automated measurements at multiple points or samples.
SoftwareQuantum for concentration, atomic percentage, depth, thickness and coating weight.
Summarized data from the official Horiba catalogue. Performance depends on optical configuration, anode, material, calibration and analysis conditions.
Solution framework
Before setting the configuration
The matrix, geometry, expected concentration and desired type of information determine the required method and accessories.
Technical indications
✓The objective is to measure elemental surface profiles to the substrate.
✓Layers, interfaces or gradients need to be resolved quickly.
✓The sample includes non-conductive or heat sensitive materials.
✓Light elements, including H, O, C or N, are important for the application.
The configuration should consider...
→Geometry, planning, available area and sample thickness.
→Elements, spectral lines and expected concentration range.
→Layer thickness and resolution in required depth.
→Need for DiP, automation, accessories for small samples or special handling.
Technical equipment
GD-Profiler 2 Catalogue
Official file embedded in this page. The download works without opening external servers.
GD-Profiler 2 · Pulsed RF GDOES with DiP
Official technical catalogue HORIBA with principle, performance, applications, source, optics, software and accessories.
Frequently Asked Questions
The essentials about GD-Profiler 2
Information for initial application evaluation.
Does GD-Profiler 2 analyze non-conductive materials?
Yes. The pulsed RF source allows working with conductive and non-conductive materials, as well as hybrid structures, according to geometry and method.
Does the equipment measure depth directly?
With the DiP feature, differential interferometry measures depth and erosion rate simultaneously with GD analysis. Without DiP, conversion can use erosion rate calibration.
What's the depth scale covered?
The catalog positions the system from the first nanometer to more than 150 micrometers, depending on the material, layer, anode and analytical conditions.
Is the technique destructive?
Yes. The discharge sprays a localized area and produces a crater in the sample.
Is it possible to automate multiple measurements?
Yes. The optional Sample Mapping Unit can automate measurements at different points or in a batch of compatible samples.
Evaluate your coating, interface or multilayer material.
Send SENS the expected composition, layer type, thickness and geometry available for analysis.